Semiconductor Engineering

Latest: HBM smuggling into China; Nvidia H200s held in Hong Kong; Micron pauses Taiwan fab; Samsung expands HBM base-die capacity; Bosch chip division; Marvell-Lumentum deal draws scrutiny; more acquisitions, market reports and earnings semiengineering.com/chip-ind… #semiconductor

College Grads And AI Computer science majors may be in an awkward space; EE grads are fine for now. semiengineering.com/college-… #AgenticAI #engineering #workforce #EEeduction @AlphaDesignAI @Cadence @Synopsys @unisouthampton #llmdaai

Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much can make the prediction break down. semiengineering.com/how-much… #semiconductor #advancedpackaging

Rise in complexity is pushing engineers to validate hardware, software, and physical constraints earlier in the design flow, but fragmented workflows make that difficult. semiengineering.com/shift-le… #semiEDA @SilvacoGroup @axiomise @Synopsys #HiveWare #semiconductor #verification

Advanced packaging, photonics, test, and AI are increasingly intertwined; very different conversations ahead. Big shifts seen at SEMICON West semiengineering.com/chip-sca… #semiconductor

New technical papers recently added to Semiconductor Engineering’s library semiengineering.com/chip-ind… #semiconductor #DRAM #CFET #HBM #EUVlithography #photonics #CIM

Latest: HBM shortages threaten AI expansion; TSMC weighs price hikes; adv. packaging ramps; domain-specialized AI models; Infineon & UMC boost fab investments; Intel’s quantum move; Lam & imec advance 3D integration; Google expands TPUs; CPU benchmarking semiengineering.com/chip-ind…

Advanced packaging growth and capacity constraints are pushing more onto OSATs. semiengineering.com/foundrie… #semiconductor #OSAT #foundries

Special Report: Engineers are discovering many things they thought were process assumptions were actually wafer assumptions semiengineering.com/what-bre… #semiconductor #PLP #panellevelpackaging #advancedpackaging

The chip industry continues to ramp, with major moves in AI hardware, HBM, manufacturing capacity, advanced packaging and export controls. semiengineering.com/chip-ind… #semiconductor #advancedpackaging #HBM #VLSI

Why Open-Weight AI Matters semiengineering.com/why-open… Proprietary models still hold the edge, but open-weight models add more flexibility for deploying AI. #openweightAImodels #AImodels #AI

Scaling Data Movement For Physical AI youtu.be/tt5Xcjf9MVo?si=5V5x… #PhysicalAI #chiplets #CPU #datamovement #chiplets @arteris_noc #coherency #semiconductor

Semiconductor fabs are leveraging AI/ML models & raw equipment data to speed up yield learning, but the volume of data they are collecting is forcing some tough decisions about optimization versus context. semiengineering.com/shift-le… #semiconductor #fabs

Fab expansion accelerates; China advances memory & EUV; Teradyne’s test deal; SEMICON West & OCP highlights; 3D SiP; TSMC & ASML signals; 300mm fab spending; optical & 3nd D-compute startups funding; quantum HW ... semiengineering.com/chip-ind… #semiconductor #lithography #DRAM

Larger packages, finer routing, and embedded functions are pushing advanced substrates toward application-specific designs.semiengineering.com/one-subs… #semiconductor #substrates #advancedpackaging #GlassSubstrates

80 chip industry-related startups raised $8.5B in Q3, with big hauls by companies tackling data movement and memory. semiengineering.com/startup-… #semiconductor #startupfunding

No single test, inspection, model, or monitoring technique provides a complete view of an advanced device. Each has physical, spatial, temporal, or contextual blind spots. semiengineering.com/closing-… #semiconductor

Latest: $2B foundry pact; hyper-NA EUV; TSMC, Samsung $; Canon's nanoimprint; AI chips under scrutiny; $10T data center buildout; $1.5B SiC boost; chip smuggling; 800V power; quantum HW scales up; mobile fab... semiengineering.com/chip-ind… #semiconductor #semiEDA

The shift from software-defined to AI-defined vehicles raises questions about whether the hardware can keep up. semiengineering.com/ai-defin… #automotive #SDVs #AIdefinedvehicles

Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design. Part 2. semiengineering.com/thermal-… #semiconductor #photonics #thermal #AIchips